Autodesk News: Electronics Cooling Study

Thermal management of printed circuit board (PCB) components depends on a number of factors including the amount of heat the components dissipate, the environment, the layout of the components on the board, and the design of the enclosure. If the circuit generates too much heat, the components risk failing due to overheating and a cooling…

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Autodesk 0% Financing Offer

  Available November 1, 2022 to January 6, 2023, this offer allows customers in the United States or Canada to make annual 1/3 payments on any eligible 3-year term deal. Eligibility Autodesk has reduced the minimum deal size to $10,000. 0% Financing under this offer applies to new or renewing 3-year term subscriptions that are…

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