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NexGenSolutions named 2023 Top Service Delivery Partner by Autodesk for another year

March 8, 2023 – For the second year in a row, NexGen Solutions has been named the Top Service Delivery Partner in the Americas at the 2023 Autodesk Platinum Club Awards in Nashville, Tennessee. This award celebrates Autodesk channel partners and their efforts to provide high quality service and support to Autodesk customers, and is measured…

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CAE Services Corp + NexGen Join Forces

NexGenSolutions, a leading provider of cutting-edge CAM and CAD software solutions, is thrilled to announce its partnership with CAE Services. CAE Services has been a renowned expert in Moldflow analysis since 1988. This collaboration aims to deliver exceptional services, training, and support for all injection mold manufacturers. CAE’s tech team is available for beyond break/fix support and…

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Our Minneapolis Summit at Top Golf was a Success!

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NexGenSolutions Welcomes Jeff Fritsch to the Team!

April, 2023 NexGen Solutions welcomes Jeff Fritsch as Vice President of Business Development and Partnerships…

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Autodesk News: Electronics Cooling Study

Thermal management of printed circuit board (PCB) components depends on a number of factors including the amount of heat the components dissipate, the environment, the layout of the components on the board, and the design of the enclosure. If the circuit generates too much heat, the components risk failing due to overheating and a cooling…

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