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Our Minneapolis Summit at Top Golf was a Success!
Webinar: Intro to Prodsmart – June 15
Thursday, June 15…
Webinar: Simplify your Fusion 360 BOM process with Bommer
Register now for our Webinar featuring Jesse from Bommer May 25th 4:00 PM ET…
NexGenSolutions Welcomes Jeff Fritsch to the Team!
April, 2023 NexGen Solutions welcomes Jeff Fritsch as Vice President of Business Development and Partnerships…
YCM Alliance Michigan Technical Center Grand Opening
From May 23-24, NexGenSolutions will have a booth at the YCM Alliance Technical Center Grand Opening in Michigan! This new high-tech facility is designed to showcase and demonstrate various complementary machining solutions available through the YCM Alliance. Register so you can see machine demonstrations, presentations, and compare all the different tech. Register here Location: Â …
Autodesk Moldflow | Partnership you can count on
Customer Challenge 3-Dimensional Services Group provides rapid manufacturing services that allow us to engineer and build functional prototype parts as well as low-to-medium volume production parts up to 70% faster than industry standards. Moldflow provides us with precise calculations to reduce prototype mold costs, avoids rework, and ensures final product quality. NexGenCAM has partnered with…
Minneapolis Top Golf Summit – Register Now!
Join us at Top Golf at Brooklyn Center in Minneapolis on April 5th…
Meyer Tool & Mfg. – Video on our Youtube
Follow along as Meyer Tool & Mfg. takes you through how Autodesk products have been implemented in all aspects of their manufacturing process. Starting with Inventor to get your design off paper into CAD to using Fusion 360 with Powermill to transform that CAD into finished goods to meet customer demands and needs….
Autodesk News: Electronics Cooling Study
Thermal management of printed circuit board (PCB) components depends on a number of factors including the amount of heat the components dissipate, the environment, the layout of the components on the board, and the design of the enclosure. If the circuit generates too much heat, the components risk failing due to overheating and a cooling…